JEDEC STANDARD Board Level Drop Test Method of Components for Handheld Electronic Products JESDB JULY JEDEC SOLID. The reliability of this package has been studied by employing the JEDEC JESDB standard drop test. In this paper, the JEDEC B-condition is applied to. The need for RoHS compliant boards coupled with the demand for reliable electronics has resulted in the development of the JEDEC Standard JESD B to.
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This is not a component qualification test and is not meant to replace any system level drop test that maybe needed to qualify a specific handheld electronic product.
The maximum component size shall be 15 mm in length or width and there shall be at least 5 and 8 jesr22 gap between the components in x- and y-direction, respectively. This acceleration factor shall be reported with the test data.
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS | JEDEC
The modulus and Tg of the dielectric materials shall be specified. These handheld electronic products are more prone to being dropped during their useful service life because of their size and weight.
The boards shall be symmetric in construction about the mid-plane of the board, except for the minor differences in the top and bottom two layers. It is recommended that the component mounting pads on the PCB be designed as per the specification in Table 3 for area array devices.
A packaged semiconductor device. JEDEC standards and publications jesd222 adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The locations of these holes are shown in Figure 1.
A total of 5 packages from the test lot shall be subjected to failure analysis to determine the root cause and to identify failure mechanism. All 15 sites on each side of the board top and bottom shall have the same component footprint.
Experience with different board orientation has suggested that the horizontal board orientation with components facing down results in maximum PCB flexure and, thus, the worst orientation for failures. The screw shall be tightened until the shoulder of the screw bottoms out against the standoff. The PTH pad diameters shall be microns for the outer jexd22 and microns for the inner layers.
JESDB B Board level drop test menthod of components for handheld eletronic products_百度文库
The electrical continuity of all nets should either be detected by an event detector or by a high-speed data acquisition system. However, a mix of different component sizes and styles shall not be used on the same board, as this will affect the dynamic response of the board, making the results difficult to analyze.
Additional strain gages may also be mounted at different locations on the board to fully characterize the strain response of the assembly. The x, y location of the center of each component location is listed in Table 4, using the center of jrsd22 left screw hole as datum.
Drop testing on other board orientation is not required but jexd22 be performed if deemed necessary. This plate will serve as the mounting structure for the PCB assemblies. Drop Test Simulation o Requirement, clause number Test method number Clause number The referenced clause 1b11 has proven to be: Because of symmetric component design and support locations, grouping see Table 6 can be used for data analysis for boards mounted hesd22 15 jesd22 refer Figure 1.
The use of shoulder screw eliminates the need to re-tighten screws between drops. It should be noted, however, that any additional mass will add significant dynamic weight to the board and may alter its dynamic response. The characterized board response acceleration, strain, and strain rate and its variation shall be documented and provided with the test data. A printed circuit board assembly with components mounted on only one side of the board double-sided PCB assembly: It is recommended to first analyze the component reliability data at individual locations without assuming any grouping.
The standard is not meant to cover the drop test required to simulate shipping and handling related shock of electronic components or PCB assemblies. Electrical continuity test shall also be performed on all mounted units to detect any opens or shorts.
At least one board shall be used to adjust board mounting process such as paste printing, placement, and reflow profile. The overall board size shall be mm X 77 mm that can accommodate up to 15 components of same type in a 3 row by 5 column format. The rigid fixture typically is covered with some form of material to achieve the desirable pulse and G levels.
A trace width of microns shall be jeds22 for all traces outside of component region.
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
The fundamental mode results in maximum displacements and is typically most damaging. The glass transition temperature, Tg, of each dielectric material as well as of the composite board shall be oC or greater.
All comments will be collected and dispersed to the appropriate committee s.